NVIDIA GTC | March 16-19 | Booth #7038 in the Market ACE Lot

Facing thermal management hurdles in scaling your AI deployments? Connect with us at NVIDIA GTC to discuss precision-engineered liquid cooling solutions that drive peak performance in data centers.

Get the latest scoop on key topics that matter to engineers:

Specification strategies for space-constrained environments
Fluid path optimization challenges and solutions
Chemical compatibility considerations
OCP advancements including v2.0 UQD
New UQD08s available from CPC

Consult with our lead engineers at NVIDIA GTC.

Mac Liu
Senior Applications Development Manager, Thermal
CPC (Colder Products Company)

Mac Liu is a Senior Applications Development Manager supporting strategic accounts deploying liquid cooling for AI and HPC data centers. Mac joined CPC in 2022 with more than 20 years of experience in liquid cooling and spent the last 5 years focused on direct to chip liquid cooling for the data center market. He earned his Bachelor of Science in Mechanical Engineering and Physics from Rutgers University.

Barry Nielsen
Senior Applications Development Manager, Thermal
CPC (Colder Products Company)

Barry Nielsen is a Senior Applications Development Manager. He has more than 20 years of experience with quick disconnects and spent the last 10 years helping customers understand application opportunities and deliver value-added solutions to organizations implementing liquid cooling thermal management. Barry works with companies innovating in implementing liquid cooling in markets ranging from data centers, 5G, and lasers to high performance computing. He earned his Bachelor of Arts from the University of St Thomas in St. Paul, MN.

Dylan Osiecki
Senior Applications Engineer, Thermal
CPC (Colder Products Company)

Dylan Osiecki is Senior Applications Engineer supporting technical customers in understanding differences between CPC’s Everis® quick disconnect product lines and sharing considerations for specifying connectors in liquid cooling systems. He comes to CPC with broad experience including as a Manufacturing Engineer, Sales Engineer and Applications Engineer. Dylan earned his Bachelor's degree in Aerospace Engineering and Mechanics at the University of Minnesota and Bachelor of Science in Physics at the University of Wisconsin.

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