Sponsored by the IEEE’s Electronics Packaging Society (EPS), ITherm 2026 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. In addition to paper presentations and vendor exhibits, ITherm 2026 will include panel discussions, keynote lectures by prominent speakers, invited technology talks, ECTC/ITherm joint networking events and short courses, and a student design competition.
Join us on May 28th at 4:30PM to hear CPC's Senior Applications Engineer, Dylan Osiecki, dive into the impact of increasing market demands on quality and reliability. Learn how to navigate testing limitations and better account for technical constraints to ensure peak performance in high-stakes environments.