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Liquid Cooling Quick Disconnects for High Performance Computing (HPC)

Computing Power Is Critical

High-performance computing (HPC) environments demand nonstop performance under extreme conditions. To maintain uptime, dense CPU and GPU configurations require not just advanced thermal solutions but also system components that won’t slow service or introduce failure points.

CPC quick disconnects are engineered to keep pace with evolving HPC infrastructure. Low pressure drop at high flow rates support efficient coolant movement through compact, high-wattage systems. Leak-resistant designs help protect sensitive components and intuitive operation makes routine maintenance faster with fewer complications. When uptime is everything, every detail matters — including the high performance computing liquid cooling quick connects that keep coolant moving.

Material Quality Matters

High performance computing connectors must deliver consistent performance across thousands of thermal and pressure cycles without degradation. CPC liquid cooling quick disconnects are manufactured with materials selected specifically for their chemical resistance and dimensional stability under thermal and mechanical stress.


Engineered polymers such as PPSU help ensure connectors remain durable, even when exposed to high temperatures and aggressive coolants. Robust sealing technologies and precision-molded valves maintain coolant flow while minimizing the risk of swelling, softening, or corrosion over time. The result is long-term performance you can rely on in all your mission-critical computing systems.

Proven Quick Disconnect Solutions for HPC Liquid Cooling

CPC’s Everis® quick connects are trusted by system designers and thermal engineers building advanced high performance computing liquid cooling systems worldwide. Developed by a team of material scientists, design engineers and thermal experts, Everis QDs are engineered specifically for liquid cooling rather than general purpose industrial applications.

  • These connectors are fabricated from high-performance materials that maintain dimensional stability under thermal and mechanical stress. 

  • Available in lightweight high-performance thermoplastics developed from UL94 V-0 rated polymer and designed to minimize the risk of galvanic corrosion or condensation, which are common concerns with metal fittings.

  • Each connector is built to perform in high-wattage, high-density computing environments where consistent performance is critical.

  • Redundant multilobed seals help maintain seal integrity through repeated thermal cycles. 

  • Full range of terminations that support secure, leak-resistant installation. 

  • Non-spill valve technology enables quick servicing while preserving coolant integrity and protecting surrounding components.

 

From edge deployments to rack-scale systems, CPC offers a wide portfolio of Everis quick disconnects that support the varied objectives of high performance computing environments.

From CPC's Knowledge Center

UQD06 Meet the UQD06

As new chip technologies are designed and ultimately released, we see higher cooling requirements and therefore a migration from smaller size QDs (1/8 inch – 1/4 inch) to larger sizes (3/8 inches). The UQD06 hybrid set is the latest release from CPC in the UQD product family. Designed to meet higher flow requirements for the hyperscale AI market.

Chemical Compatibility Chemical Compatibility in Liquid Cooling Solutions

Chemical compatibility within a liquid cooling loop helps the system performs to specification. With ongoing advances in fluid options and materials, it is important to think holistically when specifying coolant and components, taking into consideration potential interactions.