OCP APAC Summit 2026
August 11-12 | Booth PL15
As the growth of AI continues to drive rapid shifts in data center architecture, the demand for high-flow, precision cooling continues to rise. Find us on the show floor in Booth PL15 to discuss precision-engineered liquid cooling solutions that drive peak performance in data centers and high-stakes environments.
Sign up to get an exclusive look into our latest innovation - Direct Cool DC Series Connectors, a full‑flow solution engineered to support the increasing thermal demands of artificial intelligence (AI) and high‑performance computing infrastructure.