Webinars on Liquid Cooling and Specifying Fluid Connections

It’s well known that poorly designed thermal management systems can result in suboptimal performance or system failure. What isn’t as well understood are the material properties and myriad calculations that all need to be taken into consideration when developing a high-performing liquid cooling system -- or the role that quick disconnects play in supporting reliability, uptime, ease of maintenance and system performance. It’s complicated but it doesn’t need to be confusing.

There is a growing utilization of liquid cooling to address the high temperature output of electronics and computing systems. And as various types of liquid cooling techniques, systems and components evolve, the focus on materials is paramount to successful implementation. This presentation will provide a summary of how material selection of system components and subcomponents impacts performance and reliability.

When deploying liquid-cooled infrastructure for AI-enabling accelerated compute, failure is not an option. While data center efficiency has been studied, data center reliability with new liquid cooling technologies is a gap. Understanding component level reliability in a liquid cooling system supports robust rack infrastructure and efficient data center operation.

In this episode of the Open Compute Project (OCP) Podcast, Rob Coyle welcomes Beth Langer, Principal Thermal Technologist at CPC (Colder Products Company), to discuss the rapid development of quick disconnects for liquid cooling in data centers.