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    Liquid Cooling for Computer Systems

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    Liquid Cooling Quick Disconnects Help Address Computer Performance Challenges

    The amount of data is growing significantly with increases in connected devices/IoT, geo-applications and analytics supported by edge computing, cloud computing and 5G services. Virtual engagements are common across all industries, challenging computing infrastructure to keep up with 24/7 operation. Meanwhile, computing professionals around the world are tasked with increasing energy efficiency, consolidating operations and reducing costs.

    With increasing budget constraints, the computing industry is focused on lowering energy consumption by specifying advanced computer liquid cooling as part of their systems. Liquid cooling offers a powerful tool in helping address efficiency and capacity computing challenges head-on. It’s a key factor in moving the power usage effectiveness (PUE) of computing centers closer to the 1.0 goal.

    What Liquid is Used to Cool Computers

    Water is most commonly used in computer liquid cooling systems, including deionized and glycol combination solutions. Alternately, dielectric fluids like fluorocarbons and PAO can be used depending on the application.

    Compact and powerful computer processing densities generate high amounts of heat and require powerful cooling infrastructure. Liquid is up to 4,000 times better at storing and transferring heat than air.

    Benefits of Lowering Processor Temperatures Through Liquid Cooling

    • 4% reduction in solution times
    • Minimized latency by maximizing cluster interconnect density
    • Reduced power consumption - reducing fossil fuel consumption
    • Reduced CO2 emissions - a vital role in protecting the planet

    CPC Computer Quick Disconnects: Decades of Experience, Forefront of Innovation

    CPC has been delivering lightweight, non-spill/dry break, worry-free computer quick disconnects for electronics cooling for decades. Since 2010, CPC engineers have gained thermal management experience and applied their computer liquid cooling systems knowledge to quick disconnect (QD) coupling innovation. This directly led to the development of the CPC Everis® liquid cooling QDs – quick connectors that are exclusively designed and built for the rigors of liquid cooling used in applications like computing.

    5 Reasons Why Liquid Cooling is Replacing Air Cooling

    • 3,500-4,000 times more efficient at transferring heat
    • Energy use required for cooling is reduced
    • Significant cost savings results from more efficient cooling
    • Noise reduced due to slower fan speed
    • 85% reduction in carbon footprint

    With a wide portfolio of Everis Series options, CPC meets the requirements of a variety of use cases within computing applications. CPC offers the quick disconnect couplings options and coolant line fittings you need with features like dry break non-spill shut off valves and locking hose barb terminations. Everis QD application-specific design, robust testing and strict manufacturing practices assist in reaching 100% uptime, meeting performance and sustainability objectives and preparing for cutting edge technology development.

    Resources from CPC's Knowledge Center

    Chemical Compatibility in Liquid Cooling Solutions

    Chemical compatibility within a liquid cooling loop helps the system performs to specification. With ongoing advances in fluid options and materials, it is important to think holistically when specifying coolant and components, taking into consideration potential interactions.

    Fluidic Flow Considerations for Liquid Cooling

    Proper flow within a liquid cooling system helps ensure it performs to specification. While flow for liquid cooling thermal management seems simple enough, there is a lot to consider including: cooling load, Cv, specific gravity, and coolant selection.

    Check out CPC Liquid Cooling Connector Products

    Sounds of Credibility

    Superior engineering design and rigorous testing lead to robust & reliable quick disconnects for liquid cooling.