Thermal LIVE Summit, now a bi-annual virtual event, is organized by Electronics Cooling for thermal engineers. Event registrants can attend live and interact with presenters, posing their thermal management questions to engineers from various cooling system component manufacturers or watch session recordings at their convenience post-event.
“Rigor in Evaluation of Components for Liquid Cooling”
By understanding various aspects of development of components and knowing that all components from various manufacturers interact within a larger system, thermal engineers will be able to more confidently engage both suppliers as well as peer design engineers regarding requirements, product selection and validation for the thermal management applications that they are designing.
Emma Miller Applications Engineer II CPC (Colder Products Company)
Koray Sekeroglu Principal Research Engineer CPC (Colder Products Company)