CPC
Material
Pressure Range
Mounting Options
Termination Size
Valved?
Sterilization
Termination Type
Seal Options
RFID Enabled

The Cool Factor: Rising Above the Heated Innovation Race

Overview

This panel discussion will focus on how both the legacy and the next gen tech of supercomputing pioneers enables future applications (such as cloud HPC, genAI, etc.) 

The interactive panel will recount the evolution of liquid cooling in supercompute and the decades of research, expertise, and lessons learned that have now in turn enabled the rapid deployment of liquid cooling for AI. 

Leveraging industry knowledge and hand-on experience, the panel will share best practices for those looking to introduce liquid into application and views on risks and opportunities for the future. 

Panelists will provide insight into their learnings, "hot takes" on where technology is heading including future requirements in terms of performance and reliability, and advice for attendees on how to overcome tomorrow's challenges for success at scale.

Meet the Panelists

Mark Steinke is a Principal Thermal Architect at NVIDIA and focus on cooling technologies for the Data Center GPU product lines.  Prior to joining NVIDIA, he was the thermal architect that developed the first Exascale supercomputer while at HPE/Cray, with his thermal design utilized in 7 of the top 10 supercomputers in the world.  He also developed both air cooled and direct liquid cooled solutions for ultra-dense and HPC servers at Lenovo and IBM.  Mark received a Ph.D. at Rochester Institute of Technology while focusing on advanced liquid cooling for high powered microelectronics by utilizing silicon microstructures and microchannels.  He has over 50 patents and 30 publications that are focused on microelectronics cooling.  Mark is an active contributor to ASHRAE serving as the Technical Committee (TC) 9.9 Vice-Chair, a voting member, and a member of the TC9.9 IT Subcommittee.  Mark continues to focus on advance cooling methods and energy efficiency for high power electronics.

Steven Dean is the Distinguished Technologist at HPE currently leading it’s Liquid Cooling Center of Excellence. Steve has worked in the HPC industry for 40 years, initially at Cray Research, then at SGI, and finally at HPE. He has specialized in HPC system hardware architectures and is well versed in implementing system packaging, power, cooling, controls and interconnect solutions. Steve initially worked on high powered refrigeration cooled (Cray XMP) and liquid cooled systems (Cray YMP) before moving to air cooled solutions. At SGI, he lead work on high-end air-cooled systems (Origin, Altix and ICE) until power densities drove a return to liquid cooling with the ICE X in 2011and ICE XA systems in 2014. At HPE he led the development of the Apollo 9000 liquid cooled system followed by evaluating next generation system architecture concepts. He has developed liquid cooled system designs for 20 years and has numerous patents in this area.

Jason Matteson is the Global Director of Product Management at nVent in Data Solutions. He has worked in the data center industry for 28 years. Prior to joining nVent, Jason worked at IBM, Lenovo, Vertiv and most recently Iceotope Technologies. Jason contributes to several industry consortiums, including ASHRAE and OCP, has over 100 U.S. Patents, authored or co-authored several intellectual-property publications, and has given several presentations about industry power and cooling trends at various technical symposiums and conferences. Jason received a Bachelor of Science degree in Mechanical Engineering from Rochester Institute of Technology in 1997.